電子元器件技術(shù)在不斷的發(fā)展和進(jìn)步，適應(yīng)了更高要求的電子設(shè)備，貼片電容在電子設(shè)備中能夠提高設(shè)備的穩(wěn)定性，是電子設(shè)備正常穩(wěn)定運(yùn)行的輔助配件。
With the continuous development and progress of electronic component technology, the chip capacitor can improve the stability of electronic equipment, and it is an auxiliary accessory for normal and stable operation of electronic equipment.
貼片電容相對(duì)于普通的電子元器件來(lái)講，優(yōu)勢(shì)已然相當(dāng)?shù)拿黠@了。比如說(shuō)我們平時(shí)用的手機(jī)可以做得更小，可以做得更輕薄，除了有設(shè)計(jì)方面的功勞之外，還有一個(gè)重要的原因，就是這些電子元器件全部都是采用的貼片的產(chǎn)品，這樣就可以保證這里面的電路結(jié)構(gòu)尺寸進(jìn)一步的壓縮，那自然就可以生產(chǎn)出輕薄的好看好用的手機(jī)，或者是其他的一些電子設(shè)備。
Compared with common electronic components, SMC has obvious advantages. For example, the mobile phones we usually use can be made smaller and lighter. In addition to the credit for design, there is also an important reason that these electronic components are all chip products, which can ensure the further compression of the circuit structure size inside, so that we can naturally produce light, good-looking and easy-to-use mobile phones, or These are other electronic devices.
貼片電容的無(wú)引線或者引線短、體積小、重量輕、厚度薄化，尤其是無(wú)引出線或者短引出線結(jié)構(gòu),使得它更能夠經(jīng)受得住震動(dòng)和沖擊、更容易將電路工作中產(chǎn)生的熱量傳遞出去。
The chip capacitor has no lead or short lead, small size, light weight and thin thickness, especially the structure without lead or short lead, which makes it more able to withstand vibration and impact, and more easily transfer the heat generated in the circuit work.
再加上貼片電容在設(shè)計(jì)和制造時(shí)就已經(jīng)考慮到了滿足表面組裝技術(shù)中高溫焊接條件與清洗條件的要求，貼片電容的材料及其適當(dāng)?shù)姆庋b方式本身就耐高溫、不怕焊、耐潮濕。
In addition, the chip capacitor has been designed and manufactured to meet the requirements of high-temperature welding conditions and cleaning conditions in surface assembly technology. The material of SMC and its appropriate packaging method are resistant to high temperature, welding and humidity.
此外，貼片電容表面的組裝技術(shù)并不像普通電容采用的插入式技術(shù)，而采用貼片式電子元器件的表面組裝電路就從根本上消除了產(chǎn)生這一故障的根源，從而提高了電子設(shè)備的可靠性。
In addition, the surface assembly technology of SMC is not like the plug-in technology used by ordinary capacitors, but the surface assembly circuit using SMD electronic components can fundamentally eliminate the root cause of this fault, thus improving the reliability of electronic equipment.